The LG G7 ThinQ is currently one of the smartphone industry's worst kept secrets. The handset's details have been leaking online over the past couple months and just yesterday we got our clearest "official" view yet. Despite this, LG has kept quite mum on the subject, until today, when it finally announced that it would reveal the handset in full on May 2.
According to the memo posted on its Korean website, LG states that the G7 ThinQ will be unveiled at Metropolitan West in Manhattan, New York on May 2, with another event taking place at Yongsan Ip Park Mall in Seoul on May 3. The firm goes on to say that this will be the first G-series handset to hold the ThinQ moniker and that it will utilize AI in different ways like 'Voice AI' that performs various voice commands, along with 'Empathy AI' and 'Vision AI', though details about what these features would be capable of remains scarce at the moment.
There are no images or specifications revealed in the post but if previous leaks are accurate, the G7 ThinQ should pack the latest from Qualcomm utilizing the Snapdragon 845 processor, have a cutout on the top of its display, make use of a f/1.5 aperture camera, and have a physical AI button. Luckily, we won't have to wait long to find out all of the details.
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